Lifecycle Status  

PRODUCTION (Last Updated: 4 weeks ago)

Factory Lead Time  

8 Weeks

Contact Plating  

Tin

Mounting Type  

Surface Mount

Package / Case  

12-WFQFN Exposed Pad, CSP

Surface Mount  

YES

Number of Pins  

12

Current - Supply (Nom)  

3.6mA

Number of Elements  

1

Operating Temperature  

-40°C~125°C

Packaging  

Tray

JESD-609 Code  

e3

Pbfree Code  

no

Part Status  

Active

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

12

ECCN Code  

EAR99

Type  

with Latch

Max Power Dissipation  

6mW

Terminal Position  

QUAD

Terminal Form  

NO LEAD

Peak Reflow Temperature (Cel)  

260

Number of Functions  

1

Terminal Pitch  

0.5mm

Time@Peak Reflow Temperature-Max (s)  

40

Base Part Number  

ADCMP603

Pin Count  

12

Qualification Status  

Not Qualified

Output Type  

CMOS, Complementary, Rail-to-Rail, TTL

Power Supplies  

3/5V

Operating Supply Current  

3.6mA

Power Dissipation  

6mW

Current - Output  

50mA

Propagation Delay  

5 ns

Quiescent Current  

1.8mA

Response Time  

5000 ns

Common Mode Rejection Ratio  

50 dB

Voltage - Supply, Single/Dual (±)  

2.5V~5.5V

Input Offset Voltage (Vos)  

5mV

Voltage Gain  

85dB

Power Supply Rejection Ratio (PSRR)  

50dB

Supply Voltage Limit-Max  

5.5V

Max Input Current  

5μA

Input Bias Current  

5μA

Current - Quiescent (Max)  

1.8mA

Voltage - Input Offset (Max)  

5mV @ 2.5V

Current - Input Bias (Max)  

5μA @ 2.5V

Hysteresis  

100μV

CMRR, PSRR (Typ)  

50dB CMRR, 50dB PSRR

Height  

950μm

Length  

3mm

Width  

3mm

REACH SVHC  

No SVHC

RoHS Status  

ROHS3 Compliant

Lead Free  

Contains Lead